Winbond华邦成立于1987年9月，1995年正式于台湾证券交易所挂牌上市。企业总部座落于台湾中部科学工业园区。

Winbond华邦电子是一家专业的利基型内存IC设计、制造与销售公司，从产品设计、技术研发、晶圆制造到自有品牌营销全球，Winbond华邦致力提供全球客户全方位的中低密度利基型内存解决方案服务。

Winbond华邦核心产品包含闪存（Code Storage Flash Memory）、利基型动态随机存取内存（Specialty DRAM）及移动随机存取内存（Mobile DRAM），运用技术自主之优势及谨慎规划的产能策略，建立极具弹性的生产体系，并发挥产品组合相乘所产生之综效，充分满足客户多元化需求、落实自有品牌之发展。

Winbond的闪存（Code Storage Flash Memory）聚焦于中低容量产品，提供规格完整的串口式闪存（Serial Flash）和并行式闪存（Parallel Flash）产品，满足小尺寸封装规格，具有脚数低、体积小、成本低的特性；亦提供串口式 （SPI） NAND 型及单层式 （SLC） NAND 型闪存以满足客户更多的编码储存需求。Winbond华邦编码型闪存产品在计算机周边市场拥有相当的市占率，并且积极拓展应用于行动装置、消费电子，以及多样性之车用电子、物联网和穿戴装置等应用领域。此外，Winbond华邦推出业界首创TrustME Secure Flash Memory，该产品通过国际安全组织Common Criteria EAL 5+认证，适用于提高系统安全之应用范畴。

Winbond华邦以所擅长的高性能和低功耗内存核心设计技术，结合自有十二吋晶圆厂之生产优势，推出包含利基型动态随机存取内存（Specialty DRAM）和移动随机存取内存（Mobile DRAM）之全系列自有产品，专注于品牌客户及以质量需求导向的产品应用，除了在手持装置应用、消费电子及计算机周边市场都能见到Winbond华邦的产品外，更布局于良品裸晶圆、车用、工业用电子等高门坎、高质量要求的应用。

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan.

Winbond is a specialty memory IC company engaged in design, manufacturing and sales services. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele top quality low to medium density memory solutions.

Winbond's major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Our advantage of technological autonomy and prudent capacity strategy enables us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building the brand image.
In the area of Code Storage Flash Memory products, we focus on the “low to medium density” market by offering a full spectrum of Serial Flash and Parallel Flash products. Our Flash memory packages offer features such as low pin count, small size and low cost. We also offer SPI NAND and SLC NAND flash memory products to better meet the customer demands for code storage. With considerable market share in computer peripheral markets, we also actively develop a diversity of flash memory products for applications in mobile devices, consumer electronics, automotive electronics, IoT and wearable devices. Winbond introduces the pioneering TrustME Secure Flash Memory that has been Common Criteria EAL 5+ certified for applications in enhanced system security. 

Winbond specializes in the design of high-performance, low-power memory. With a 12-inch fab, we offer a whole series of Specialty DRAM and Mobile DRAM products that target a top-tier clientele and quality-oriented applications. Winbond’s products are used extensively in handheld devices, consumer electronics and computer peripherals. We also focus on high-barrier, high-quality applications, such as KGD, automobile and industrial electronics.

To provide timely and respective services to clients around the world, Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong and Israel. With regard to quality, Winbond implements rigorous process control and quality control, strengthening yield analysis and supply chain management to satisfy customer needs. The long-standing efforts in quality assurance have earned the Company a good reputation and resulted in the accreditation of ISO 9001, TS 16949, QC 080000, ISO 14001, and OHSAS 18001.

In the future, Winbond will continue to provide customer-oriented services and concentrate our resources on the markets in which we have a competitive advantage. At the same time, riding on the strength of our advanced semiconductor design and manufacturing know-how, coupled with the innovation and wisdom of our employees, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirits of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a world-class solution provider.